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PowerViews
December 10, 2012
Ultra-Compact Power Design
Michael Althar
VP & GM, Intersil MultiMarket Power Products, Intersil Corporation
Power Channels: Communications Power, Digital Power, Energy Efficiency, Packaging and Cooling, Power Components, Switch-Mode Power
Darnell Group interviewed Michael Althar, Vice President & GM, Intersil MultiMarket Power Products for Intersil Corporation to discuss the newly-announced ISL8225M, which the company claims as the industry’s first 30A fully-encapsulated power module with the industry’s highest power density, and which dramatically simplifies the design of high-performance board-mounted power solutions.
As modern networking processors, FPGAs, memory and other complex digital circuits demand higher and higher currents at well regulated low voltages, the power supply design challenges for system designers are increasing dramatically. Intersil has supported the designer in solving these challenges by introducing the ISL8225, the industry’s highest power encapsulated power module. The ISL8225M and a few resistors and capacitors provide a complete high power DC to DC converter solution for intermediate rail or POL application in an extremely small footprint.
Importantly, Intersil has also made it considerably easier for the designer with the availability of a range of reference designs to suit the engineer’s requirements that can be simply cut and pasted into a board designer’s layout, enabling a non power expert to quickly implement a dense, high performance converter solution.
The ISL8225M can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans.
Intersil’s encapsulated power modules provide this high power density by utilizing thermally enhanced power packages for superior high power performance. The company’s custom QFN packages provide the power density and thermal conductivity that allows a designer to implement a 100W power solution without requiring airflow or heat sinks, providing a much denser solution than competitive modules that would require system fans and heat sinks. These enhanced fully encapsulated QFN packages feature large thermal pads on the bottom of the package for enhanced thermal conductivity, and exposed leads around the edge of the package provide easily accessible test points for the all-important monitoring and debug purposes.
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