Powerex Introduces Low-Profile SiC MOSFET Modules Featuring Multiple Circuit Topologies

Created with a low profile and multiple circuit topologies, including independent; dual; in parallel; common collector; and common emitter, two new Powerex split dual SiC MOSFET Modules (QJD1210010 and QJD1210011) are designed for use in high frequency applications.

Each module consists of two MOSFET Silicon Carbide transistors, with each transistor having a reverse-connected Zero Recovery® free-wheel silicon carbide Schottky diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.

Product ratings and characteristics – rated at 100A/1200V, QJD1210010 and QJD1210011 – feature: a junction temperature of 175°C; silicon carbide chips; low internal inductance; industry leading RDS(on); high speed switching; low switching losses; low capacitance; low drive requirement; high power density; isolated baseplate; 2 individual switches per module; and copper baseplate on QJD1210010 and, for extended thermal cycle life, AlSiC baseplate on QJD1210011.

These MOSFET modules can be used in various high frequency applications, including:

– Energy saving power systems, such as fans, pumps and consumer appliance.

– High frequency type power systems, such as UPS, high speed motor drives, induction heating, welding and robotics.

– High temperature power systems, such as power electronics in electric vehicle and aviation systems.

The QJD1210010 can be purchased at sample pricing at $3,055 each. The QJD1210011 can be purchased at sample pricing at $3,175 each.