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New Products
February 21, 2013
Siliconix Introduces ThermaSim 3.0 for Power MOSFETs with Temporal Zooming Down to 1ns
Vishay Intertechnology, Inc. announced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise analysis of simulated temperature profiles, the latest version of ThermaSim has been enhanced with a number of key features such as temporal zooming of die temperature with respect to power, and the ability to define more real-world conditions for increased simulation accuracy and design reliability, while simplifying the user experience.
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While other thermal simulation tools offer package-level averages, ThermaSim is created using finite element analysis (FEA) techniques for increased accuracy. The free online tool is especially useful in high-current, high-temperature applications such as automotive, fixed telecom, desktop and laptop computer, and industrial systems. The latest version is also ideal for applications with tight design margins and those subject to transient conditions, including UIS (unclamped inductive switching) and automotive load dump.
ThermaSim helps designers reduce time to market by allowing detailed thermal simulations of Vishay Siliconix power MOSFETs, ICs, and DrMOS products to be performed before prototyping. For high-confidence designs, ThermaSim 3.0 offers a number of new and improved features in several areas.
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Design reliability is increased with temporal zooming (1000 steps max.) of the simulated power dissipation data for MOSFETs. This is especially useful for high power pulses (kW range) with short durations (≥ 1 ns) at multiple locations on the time scale of the simulation profile. In addition, the ability to define the dissipating zone at 10 %, 15 %, or 25 % of the original MOSFET die area allows for better analysis of conditions such as low gate drive and drain-source voltage spikes.
To save time and eliminate potential data entry errors, ThermaSim 3.0 allows users to easily upload power profile datasets in Excel®, repeat power profile datasets as many times as needed, and exchange the simulation results and a copy of the full design with other users when desired. In addition, the enhanced tool offers component orientation on the PCB with a graphical display.
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Users can now define even more conditions, including copper spreading on the top and bottom PCB layers, solder thickness, solder joint quality, air gaps, glue/isolator thickness, and wires terminating on or off the PCB. Asynchronous reloading and Web interface (AJAX), along with load balancing and high meshing resolution, provide results even faster.
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