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Industry News
March 4, 2013
MagnaChip to Offer 0.35um Ultra-High Voltage BCD Process for Integrated Smart Energy Applications
MagnaChip Semiconductor Corporation announced that it now offers a 0.35-micron ultra-high voltage 700V BCD (Bipolar/CMOS/DMOS) process technology targeted at the growing smart energy market for applications such as ac-dc and switched-mode power supplies as well as LED lighting. The ultra-high voltage 700V BCD technology enhances performance by significantly lowering conduction and switching losses.
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This feature is accomplished by combining dual gate CMOS (3.3/5.5V) integration technology with two medium voltage (20/40V) LDMOS and ultra-high voltage (700V) applications in a single process. The new ultra-high voltage (700V) process will include JFET and depletion mode LDMOS for start-up and low on resistance LDMOS for power devices.
This new process enables foundry customers to design a cost competitive and highly reliable one-chip solution that integrates a DC-DC controller and a start-up function together with high density CMOS. The ultra-high voltage LDMOS sustains a breakdown voltage up to 800V while maintaining a low specific on resistance. It also provides customers with design flexibility by allowing the selection of either a JFET or depletion-mode LDMOS start-up device depending on cut-off voltage and current handling requirements.
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This new BCD 700V technology also supports MagnaChip's various process module options such as 20V parasitic NPN/PNP BJT, high resistance poly, Zener diodes, poly fuse, and high voltage ESD protection. This new high-voltage process is scheduled to be available by June 2013
"We are very pleased to offer our ultra-high voltage 700V BCD technology to meet the growing global demand for smart energy products. Our new 700V BCD process will provide foundry customers with increased design flexibility and integration to address the broad spectrum of design complexity and end market requirements," said Namkyu Park, Senior Vice President of Marketing for MagnaChip's Semiconductor Manufacturing Services Division. "Our goal is to continue to provide advanced process solutions for the application-specific needs of our foundry customers."
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