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Video Coverage
APEC 2008: Bonus Coverage
Infineon Technologies
Multiple product announcements including, a 900V CoolMOS device, high-efficiency 40V, 60V and 80V OptiMOS devices, and the CanPak line of products that are pin-compatible with products from IR.
Green Building Power Forum 2010
Darnell's Digital Power Forum 2009
Green Building Power Forum 2009
nanoPower Forum 2009
APEC 2009
Darnell's Digital Power Forum 2008
Bob White, Independent Consultant
Thomas Wilson, SIMPLIS Technologies
Power Electronics Tour of Ireland
Power Electronics Industry Group
Advanced Magnetics Characterization Lab
Stokes Research Institute Overview
Dr. Peter Zdebel, ON Semiconductor
Prof. Charles Sullivan, Dartmouth College
Prof. John Shen, University of Central Florida
Dr. Fred Roozeboom, NXP Semiconductors
Jose Cobos, Technical University of Madrid
Dr. Cian OMathuna, Tyndall National Institute
Leo Warmerdam, PhD, NXP Semiconductors
Seamus ODriscoll, Texas Instruments
Darnell's Digital Power Forum 2008
nanoPower Forum 2008
PCIM Europe 2008
APEC 2008
Consumer Electronics Show 2008
Electric Vehicle Symposium 23
Darnell's Digital Power Europe 2007
Fairchild Semiconductor's 50th Anniversary
Darnell's Digital Power Forum 2007
Bob White, Staff Engineer, Astec Emerson Network Power
Randy Malik, Senior Applications Engineer, IBM
Mohan Mankikar, President, Micro Tech Consultants
Brian Zahnstecher, Hardware Development Engineer, Hewlett Packard