New Industry Products

Fairchild’s Dual Cool™ Package Improves Power Density and Performance in DC-DCs

January 07, 2013 by Jeff Shepard

Designers of dc-dc conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor's new mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to help with these design challenges.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC (max RDS(ON) = 1.1mΩ at VGS = 10V, ID = 44A, max RDS(ON) = 1.5mΩ at VGS = 4.5V, ID = 37A), 60V FDMS86500DC (max RDS(ON) = 2.3mΩ at VGS = 10V, ID = 29A, max RDS(ON) = 3.3mΩ at VGS = 8V, ID = 24A), 80V FDMS86300DC (max RDS(ON) = 3.1mΩ at VGS = 10V, ID = 24A, max RDS(ON) = 4.0mΩ at VGS = 8V, ID = 21A) and the 100V FDMS86101DC (max RDS(ON) = 7.5mΩ at VGS = 10V, ID = 14.5A, max RDS(ON) = 12mΩ at VGS = 6V, ID = 11.5A).

These devices are synchronous rectifying MOSFETs that are suitable for use in dc-dc converters, telecom secondary-side rectification and high-end server/workstation applications. The 80V FDMS86300DC features the industry's lowest RDS(ON) by approximately 35% as compared to competitive solution with same voltage rating

Samples are available upon request. Delivery of production quantities is 8-12 weeks ARO. All devices in this product family are available in a PQFN 5x6 8L package and are priced at (in lots of 1,000 pieces): FDMS8320LDC (40V), $1.09; FDMS86500DC (60V), $1.16; FDMS86300DC (80V), $1.16; and the FDMS86101DC (100V), $1.09.